Thermal Stress Analysis and Optimization of SCSP Chip Package 叠层CSP芯片封装热应力分析与优化
Research on the Optimization Model of Ammunition Set Package Based on Heuristic Algorithm 基于启发式算法的弹药配套包装优化模型研究
A software system of oil-field development planning decision support is supplied, setting development planning data tracing, index prediction, projects optimization, planning making, and financial evaluation on project into one package. 研制了油田开发效益规划决策支持系统软件,实现了开发规划跟踪、指标预测、方案优化、方案编制、方案经济评价的一体化。
Discontinuous Optimization on the Spatial Containerization of Cubic Package and Visualizing 立方体包装件集装优化及可视化研究
Mathematical models for pipe diameter optimization and pump station optimization calculation were constructed, solution to model was determined and LINGO optimization software package was introduced. 建立了管径优化与泵站优化计算的数学模型,确定了模型的解法并引入了LINGO优化软件包。
Thermal Stress Analysis and Optimization in Stacked Die Package Under Power Load 功率载荷下叠层芯片封装的热应力分析和优化
According to the application in the design of spring and bearing, the mechanical optimization package is practical, effective and extendable. 通过弹簧、轴承的优化设计,说明所建立的机械优化设计软件包是可行的、有效的,有较强的扩展性。
Optimization of brazing process for ceramic package 陶瓷外壳钎焊的工艺优化
Optimization of Transport Package in Logistics Chain 物流链中的运输包装优化问题
Research and Application of Reactive Optimization Plan Software Package to Distribution Grid 配电网无功优化规划软件包的研制与应用关于{x/n}的分布
An Optimization Program Package for Gear Reducers 一种齿轮减速器优化程序包
Design of Mechanical Optimization Software Package by Object-orientated Method 基于对象的机械优化设计软件包设计
Wind Tunnel Test of Optimization and Matching on the Cooling Package Performance of a Wheel Loader 轮式装载机冷却组优化匹配的风洞试验
With the purpose of developing mechanical optimization software package with expandable property, object-orientated method is applied to designing the software. 根据对机械优化设计软件包的功能分析,采用面向对象的设计方法,将机械优化设计软件包分解为两个对象:模型创建对象和优化系统。
A simulation optimization package based on genetic algorithms is designed to solve the optimization problem of the stochastic system. 为了解决随机性系统的仿真优化问题,基于遗传算法设计了一个仿真优化包。
Mathematical model, fea-tures and applications of the optimization package are de-scribed. 介绍了优化程序包的数学模型、特点及应用,给出了流程框图。
Chip Stress Analysis and Structure Optimization in Stacked Multi-Chip Package 多芯片叠层封装中的芯片应力分析及结构优化
The general architecture, main algorithms and implemented functions of an optimization software package for distribution network planning based on GIS are introduced. The principle of graphic interface implementation is emphasized. 介绍了一个基于地理信息系统(GIS)的配电网优化规划软件包的总体结构、主要算法和实现的功能,并重点介绍了图形界面的实现原理。
In chapter four, separation conditions of different types of complex samples were optimized based on the proposed fast multivariate gradient optimization strategy and corresponding software package. 在第四章中,依据建立的快速多元梯度优化策略及其软件包,对不同类型复杂样品进行分离条件优化。
Design and Implementation of a Simulation Optimization Package Based on Genetic Algorithm 一个基于遗传算法的仿真优化包的设计与实现
Thermo-structural stress analysis and optimization of PBGA package design PBGA封装体的热-结构数值模拟分析及其优化设计
The veracity of the simulation results is validated by experiments and the effect of the size of capillary hole on vacuum degree is analyzed. The parametrical modeling, simulation, and optimization design of vacuum package process of MEMS devices are realized. 通过实验初步验证了模拟结果的准确性,分析了毛细孔尺寸对腔体和烘箱真空度的影响,实现了MEMS器件真空封装工艺的参数化建模与模拟和仿真优化设计。
A simulation optimization case of inventory system shows that the simulation optimization package designed in this paper is feasible and efficient. 库存仿真优化实例表明所设计的仿真优化包是可行且有效的。优化体育教学方法,首先,须确立适度可行的教学目标;
Considering the specific characters of three-dimensional load optimization of luggage vehicles in luggage and package transportation, the author establishes the mathematical optimization model and puts forward the genetic algorithm for resolution so as to attain good loading quality and capacity. 结合行包运输行李车三维装载优化问题的具体特点,建立其优化数学模型并提出应用遗传算法求解,以获得行包优化装载方案,达到充分利用行李车装载质量或装载容积的目的。
Parallel Algorithm Research and Optimization of the YH Vectorized Linear Algebra Package 银河机向量线性代数库的并行算法研究及优化
Structure optimization of the package design in different approaches shows that thinner package body, lower chip stress level and smaller package warpage can be realized in this product. The study would be beneficial to improve the reliability of stacked MCP products. 结果表明,该封装产品可以在更低的封装高度下实现,并具有更低的芯片热应力水平及更小的封装体翘曲,这有助于提高多芯片叠层封装产品的可靠性。
Developed an active integrated package design, optimization methods and improve the reliability of the integrated module package. Finally, use the experiment verifying the correctness of the theory and process feasibility. 研究出一套有源集成封装设计和优化的方法,提高了集成封装模块的可靠性。最后本文通过实验,验证有源器件的开关损耗和电应力的数学模型。
The study of the thermal fracture problems of package structures with interfaces is very important for the structure of the designment, optimization and reliable application of package structures. 研究封装结构界面热断裂问题,对于该结构的设计、优化及安全使用具有重要意义。
At the end of this article, we put the time-series model and genetic optimization of neural network package into a system as a platform for human-computer interaction for future similar projects, which to provide some degree of convenience. 本文最后把时间序列模型与遗传优化神经网络封装成为一个系统,作为人机交互的平台,为今后类似的工程提供了某种程度上的便利。
The optimization design was done for the ultra-thin stacked die package: increasing the chip thickness and reducing the thickness of substrate were helpful to improve the hygro-thermal reliability under certain conditions. 对超薄叠层芯片封装进行了优化设计,在一定条件下,增加芯片厚度、减小基板厚度有利于提高可靠性。